[Zurück]

B. Schwarz, C. Schrank, C. Eisenmenger-Sittner, M. Stöger-Pollach, M. Rosner, E. Neubauer:
"Molybdenum interlayers as adhesion promotors for thin copper films on plasma treated glassy carbon";
Poster: Joint Vacuum Conference 10, JVC-10, Portoroz, Slovenien; 28.09.2004 - 02.10.2004.

The adhesion of sputtered Copper (Cu) coatings on plane glassy Carbon (C) substrates can be increased by a Nitrogen-RF-plasma pre-treatment and by use of thin Molybdenum (Mo) interlayers. If the Cu-coating is deposited directly on a plasma-treated C-substrate at room temperature the adhesion of Cu to C is excellent. A following thermal treatment (800 °C, high vacuum, 1 hour) reduces the adhesion of Cu to C due to de-wetting of the Cu coating from the C substrate by grain boundary grooving. De-wetting can be suppressed if a 100 nm Mo interlayer is present and the adhesion values are also increased again. This work shall analyse the interface in the C/Cu and C/Mo/Cu sample by analytical Cross Sectional Transmission Electron Microscopy (XTEM) and Secondary Ion Mass Spectroscopy (SIMS).
This work is supported by the Austrian Science Fund (FWF) under grant Nr. P-14534. The TEM-investigations were performed in collaboration with the University Service Centre for Transmission Electron Microscopy (USTEM) of the Vienna University of Technology.