[Zurück]

B. Schwarz, C. Schrank, C. Eisenmenger-Sittner, M. Stöger-Pollach, M. Rosner, E. Neubauer:
"Molybdenum interlayers as adhesion promotors for thin copper films on plasma treated glassy carbon";
Surface & Coatings Technology, 200 (2006), 16-17; S. 4891 - 4896.

Molybdenum interlayers as adhesion promotors for thin copper films on plasma treated glassy carbon

Autoren:
B. Schwarz a, C. Schrank a, C. Eisenmenger-Sittner a, M. Stöger-Pollach a, M. Rosner b and E. Neubauer c

a Institute of Solid State Physics E-138, Vienna University of Technology, Wiedner Hauptstrasse 8-10, Vienna A-1040, Austria
b Institute of Chemical Technologies and Analytics E-164, Vienna University of Technology, Getreidemarkt 9, Vienna A-1060, Austria
c ARC Seibersdorf Research GmbH, Dept. Materials and Production Engineering, Seibersdorf A-2444, Austria

Received 3 March 2005; accepted 27 April 2005. Available online 31 May 2005.

Abstract:
The adhesion of sputtered Copper (Cu) coatings on plane glassy Carbon (C) substrates can be increased by a Nitrogen-RF-plasma pre-treatment and by use of thin Molybdenum (Mo) interlayers. If the Cu coating is deposited directly on a plasma treated C substrate at room temperature the adhesion of Cu to C is excellent. A following thermal treatment (800 °C, high vacuum, 1 h) reduces the adhesion of Cu to C due to de-wetting of the Cu coating from the C substrate by grain boundary grooving. De-wetting can be suppressed if a 100 nm Molybdenum interlayer is present and the adhesion values are also increased again. This work shall analyse the interface in the C/Cu and C/Mo/Cu sample by analytical Cross Sectional Transmission Electron Microscopy and Secondary Ion Mass Spectroscopy.

Keywords: Adhesion promotor; MMC; Copper; Glassy carbon; De-wetting; Molybdenum

http://aleph.ub.tuwien.ac.at/F?base=tuw01&func=find-c&ccl_term=AC05938293

http://dx.doi.org/10.1016/j.surfcoat.2005.04.042