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Zeitschriftenartikel:

S. Stanzl-Tschegg, K. Eichinger, A. Weidner, E. Tschegg, J. Bernardi, B. Schönbauer:
"Role of impurities and PSBs on microcracking of polycrystalline copper at very high numbers of cycles";
Key Engineering Materials, 465 (2011), S. 29 - 34.



Kurzfassung englisch:
Fatigue cracks in polycrystalline copper may originate from PSBs or grain boundaries. They usually form at the specimen surfaces, but also internal small stage I (shear) cracks have been observed with the ECC/SEM technique. They are formed together with a strongly elongated dislocation cell structure, which is reflecting in many cases localized deformation in "slip lamellae" with eventual ladder-like features, being typical of PSBs. Both, PSBs and small non-propagating cracks are initiated at cyclic stress/plastic strain amplitudes below the conventionally reported PSB threshold values, if the number of cycles exceeds a minimum, e.g. approximately 5x108 in the VHCF range. The internal small cracks are formed not only in polycrystalline electrolytic copper of 99.98% purity but also in high purity (99.999%) material.


"Offizielle" elektronische Version der Publikation (entsprechend ihrem Digital Object Identifier - DOI)
http://dx.doi.org/10.4028/www.scientific.net/KEM.465.29


Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.